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TB2924AFG 2007-01-26 1 toshiba bi-cmos digital integr ated circuit silicon monolithic TB2924AFG class d, 20 w 2-channel (btl) low-frequency power amplifier ic the TB2924AFG is an audio output ic that employs the highly efficient class d method, developed for tv and home audio applications. the TB2924AFG eliminates the need for heatsink (note) , thus allowing the design of an end pr oduct with a small footprint. it also incorporates a range of features, such as standby and muting, as well as different protective circuits. features ? output: p out = 13 w 2ch (typ.) btl v cc = 12 v, r l = 4 ? , thd = 10%, f = 1 khz p out = 7.5 w 2ch (typ.) btl v cc = 12 v, r l = 8 ? , thd = 10%, f = 1 khz p out = 19.5 w 2ch (typ.) btl v cc = 15 v, r l = 4 ? , thd = 10%, f = 1 khz p out = 21 w 2ch (typ.) btl v cc = 20 v, r l = 8 ? , thd = 10%, f = 1 khz ? high efficiency: when output is 10 w = 88% (v cc = 15 v, r l = 8 ? ) ? distortion: 0.1% (1 w output, f = 1 khz) ? gain: 34db (typ.) ? small flat package: hsop36-p-450-0.65 ? muting/standby features ? thermal agc features ? master and slave oscillation frequencies ? oscillation frequency: f sw = 200 khz (typ.) ? operating supply voltage range (4 ? ): v cc (opr) = 11 v to 18 v (t opr = 0c to 75c), v cc (opr) = 11.4 v to 18 v (t opr = ? 20c to 75c) ? operating supply voltage range (8 ? ): v cc (opr) = 11 v to 20 v (t opr = 0c to 75c), v cc (opr) = 11.4 v to 20 v (t opr = ? 20c to 75c) ? protective circuits: thermal shutdown , short-circuit protection (load) these protection functi ons are intended to avoid some output shor t circuits or other abnormal conditions temporarily. these protect functions do not warrant to prevent the ic from being damaged. in case of the product would be operated with exceeded guaranteed operating ranges , these protection features may not operate and some output short circui ts may result in the ic being damaged. the TB2924AFG does not contain protection circuitry for shorts against v cc and ground. extra cares, such as incerting fuses, should be exercised when output pins se rve as line output or adjacent pins are shorted together on the board. note: generally, the average power of the audio signal cons titutes only one-fifth to one-tenth of the maximum output power, and in practice, will not exceed the permissible lo ss. however, care should be exercised so that it will not be really exceeded, considering the board?s therma l resistance, ambient tem perature, average output power and so forth. toshiba has verified that t he TB2924AFG works properly without a heatsink on the toshiba pc board for up to 10-watt by 2-channel output typical (v cc = 15 v, r l = 8 ? , thd = 10%, f = 1 khz) with a sine-wave input. ? this product are sensitive to electrostatic discharge. when handling this product, protect the environment to avoid electrostatic discharge.(mm: 200 v ok, hbm: 1500 v ok) ? install the product correctly. otherwise, it may result in break down, damage and/or degradation to the product or equipment. weight: 0.85 g (typ.)
TB2924AFG 2007-01-26 2 pin assignment and block diagram * : some of the functional blocks, circuits, or constant s in the block diagram may be omitted or simplified for explanatory purpose. 1 2 3 4 5 6 7 8 9 10 11 12 28 29 30 19 20 21 22 23 24 25 26 27 out 1 ( ? ) 13 14 15 16 17 18 31 32 33 34 35 36 v reg boot 1 ( + ) out 1 ( + ) nc pw gnd1 pw v cc1 nc boot 1 ( ? ) feed 1 ( + ) pre gnd1 rip/f nc in1 feed 1 ( ? ) v cc /2 stby mute nc nc boot 2 ( + ) out 2 ( + ) pw gnd2 out 2 ( ? ) pw v cc2 nc boot 2 ( ? ) osc out pre gnd2 osc sw in2 feed 2 ( ? + ) nc osc in pre v cc agc v cc /2 v cc /2 agc agc v cc /2 v cc /2 agc
TB2924AFG 2007-01-26 3 pin functions pin no. symbol description 1 v reg reference supply voltage 2 boot1 ( + ) ch1 bootstrap pin ( + ) 3 out1 ( + ) ch1 main amplifier output pin ( + ) 4 nc no-connection pin (not connected inside the ic) 5 pw gnd1 gnd for ch1 main amplifier output stage 6 out1 ( ? ) ch1 main amplifier output pin ( ? ) 7 nc no-connection pin (not connected inside the ic) 8 boot1 ( ? ) ch1 bootstrap pin ( ? ) 9 pw v cc1 power supply pin for ch1 main amplifier output stage 10 pre-gnd1 signal gnd 11 rip/f ripple filter pin 12 nc no-connection pin (not connected inside the ic) 13 in1 ch1 main amplifier input pin 14 feed1 ( ? ) ch1 main amplifier feedback pin ( ? ) 15 feed1 ( + ) ch1 main amplifier feedback pin ( + ) 16 stby standby control pin 17 mute muting control pin 18 v cc /2 midpoint potential pin 19 nc no-connection pin (not connected inside the ic) 20 pre v cc signal power supply pin 21 osc in pwm oscillation frequency input pin 22 osc out pwm oscillation frequency output pin 23 feed2 ( + ) ch2 main amplifier feedback pin ( + ) 24 feed2 ( ? ) ch2 main amplifier feedback pin ( ? ) 25 in2 ch2 main amplifier input pin 26 osc sw oscillator on/off switch pin 27 pre-gnd2 signal gnd 28 pw v cc2 power supply pin for ch2 main amplifier output stage 29 boot2 ( ? ) ch2 bootstrap pin ( ? ) 30 nc no-connection pin (not connected inside the ic) 31 nc no-connection pin (not connected inside the ic) 32 out2 ( ? ) ch2 main amplifier output pin ( ? ) 33 pw gnd2 gnd for ch2 main amplifier output stage 34 out2 ( + ) ch2 main amplifier output pin ( + ) 35 boot2 ( + ) ch2 bootstrap pin ( + ) 36 nc no-connection pin (not connected inside the ic)
TB2924AFG 2007-01-26 4 supplementary explanation 1. pin 17 (muting switch) ? enable or disable audio muting. ? the input amplifier is switched to a dummy amplifier within the ic , so that the audio output is muted with the amplifier still operating (pwm switched operation with 50% duty ratio). ? pin 17 outputs a voltage of approximately 2.4 v (approx. 4 v f ) when open, while v th for the built-in switch is lower than 1.8 v. leaving th e pin open, therefore, disables muting. ? logic ?h? or open: demute ?l? (gnd): mute on 2. pin 16 (standby switch) ? when the voltage on pin 16 becomes 1.8 v or higher, the bias circuit activates, enabling the ic to operate. ? logic ?h?: ic active ?l? (gnd): ic standby on 3. thermal agc function and thermal shutdown circuit ? if the chip temperature exceeds the junction temperature (150c min.), the thermal agc function attenuates the input signal to ma intain the chip temperature below the junction temperature. ? if the chip temperature further increases, the thermal shutdown circuit activates. the chip recovers from the thermal shutdown state once the chip te mperature falls below the junction temperature. 4. master and slave oscillation freq uencies (osc in, osc out, osc sw) ? when configuring a multichannel am plifier system with three or more channels, the oscillation frequency for a single ic can be used as a master and supplied to other ics to prevent a beat due to a difference among switching fr equencies.(max.6ch (3ics)) ? the oscillators for slave ics should be turned off using the osc sw pin. ?h?: turn the oscillator on ?l? (gnd): turn the oscillator off (example with multiple ics) 21 22 osc out osc in 470 pf v cc /2 21 22 osc out osc in open master ic slave ic 26 osc sw pre v cc 26 osc sw pre gnd
TB2924AFG 2007-01-26 5 5. reduction of pop noise generated when turning on and off the power supply ? to reduce pop noise, it is recommended to enable muting by setting pin 17 (mute switch) to logic low before turning on or off the power supply or standby mode. timing charts may be simplified for explanatory purpose. 6. board mounting consideration the switching of the TB2924AFG is controlled with a rectangular-wave signal of approximately 200 khz (typical). it is recommended to place the TB2924AFG far from the tuner portion, etc. that might be affected. when turning on or off the standby mode (when the power supply is not turned on or off) mute pin standby pin turn on or off the standby mode after turning on muting. when the power supply is off mute pin standby pin turn off the power supply after turning on muting. don?t turn off the standby mode before turning off the power supply. power supply pin when the power supply is on mute pin standby pin turn on the power supply after turning on muting.
TB2924AFG 2007-01-26 6 absolute maximum ratings (ta = 25c) characteristics symbol rating unit power supply v cc 23 v output current i o(peak) 8 a power dissipation p d 14.7 (note) ? 20 to 75 c storage temperature t stg ? 55 to 150 c note: when the ic is used at 25c or higher with infinite heat sink, reduce 117.6 mw per 1c. the absolute maximum ratings of a semiconductor device ar e a set of specified parameter values, which must not be exceeded during operatio n, even for an instant. if any of these rating would be exceed ed during operation, the device electrical characteristics may be irreparably altered and the reliability and lifetime of the device can no longer be guaranteed. moreover, these operations with exc eeded ratings may cause break down, damage and/or degradation to any other equipment. applications using the device should be designed such that each absolute maximum ra ting will never be exceeded in any operating conditions. before using, creating and/or produc ing designs, refer to and comply with the precautions and conditions set forth in this documents.
TB2924AFG 2007-01-26 7 electrical characteristics 1 (unless otherwise specified, v cc = 15 v, f = 1 khz, r g = 600 ? , r l = 8 ? , ta = 25c) characteristics symbol test circuit test condition min typ. max unit quiescent supply current i ccq 1 vin = 0 ? 55 70 ma p out (1) 1 thd = 10% 9 10.5 ? p out (2) 1 v cc = 18 v, thd = 10% 12.5 15 ? p out (3) 1 r l = 4 ? , v cc = 12 v, thd = 10% 11.5 13 ? output power p out (4) 1 r l = 4 ? , v cc = 15 v, thd = 10% 18 19.5 ? w (1) 1 p out = 10 w 80 88 ? efficiency (2) 1 p out = 1.0 w 63 66 ? % total harmonics distortion thd 1 p out = 1 w ? 0.1 0.3 % voltage gain g v 1 v out = 0.775 vrms 32.5 34 35.5 db channel balance cb 1 v out = 0.775 vrms ? 1.0 0 1.0 db input impedance r in 1 ? ? 30 ? k ? crosstalk c.t. 1 r g = 10 k ? , v out = 0.775 vrms ? 56 ? 65 ? db output noise voltage v no 1 r g = 10 k ? , b.w. = din audio ? 0.2 0.3 mvrms switching frequency f sw 1 ? 160 200 300 khz standby supply current i stb 1 during standby ? 0.2 0.34 ma power transistor on resistance r ds-on 1 ? ? 0.3 ? ? mute attenuation level att mute 1 0db = v out = 0.775 vrms ? 71 ? 78 ? db v mute off 1 not muted 1.8 ? v cc control voltage for pin 17 muting switch v mute on 1 muted gnd ? 0.9 v v stb off 1 amplifier operating (not standby) 1.8 ? v cc control voltage for pin 16 standby switch v stb on 1 amplifier stopped (standby on) gnd ? 1.1 v v osc on 1 oscillator operating 1.8 ? v cc control voltage for pin 26 oscillator on/off switch v osc off 1 oscillator stopped gnd ? 0.5 v
TB2924AFG 2007-01-26 8 test circuit diagram 1 * : output l (4 ? ): 10 h (a7502by-100m: toko, inc.) * : output c (4 ? ): 1.0 f * : output l (8 ? ): 18 h (a7502by-180m: toko, inc.) * : output c (8 ? ): 0.47 f * : components in the test circuits are only used to obtai n and confirm the device char acteristics. these components and circuits do not warrant to prevent the applic ation equipment from malfunction or failure. * : in addition to the low-pass filters (chebyshev lpfs) shown above, a fourth low-pass filter with a cut-off frequency of 30 khz is used for device characterization. out c 100 k 1 2 3 4 5 6 7 8 9 10 11 12 28 29 30 19 20 21 22 23 24 25 26 27 out1 ( ? ) 13 14 15 16 17 18 31 32 33 34 35 36 heat sink heat sink v reg boot 1 ( + ) out 1 ( + ) nc pw gnd1 pw v cc1 nc boot 1 ( ? ) feed 1 ( + ) pre gnd1 rip/f nc in1 feed 1 ( ? ) v cc /2 stby mute nc nc boot 2 ( + ) out 2 ( + ) pw gnd2 out 2 ( ? ) pw v cc2 nc boot 2 ( ? ) osc out pre gnd2 osc sw in2 feed 2 ( ? ) feed 2 ( + ) nc osc in pre v cc 0.47 f in1 1 f 0.1 f 560 pf 150 out l out l 150 560 pf out c out c r l 8 ? 1 f 330 f 1800 pf 1800 pf 1 f 470 f /50 v 0.1 f 0.1 f 560 pf 150 150 560 pf out l out l out c r l 8 ? 1 f 330 f gnd 1800 pf 1800 pf 470 pf 1 f in2 1 f 330 f v cc 0.1 f standby on mute on 4.7 f lpf lpf test point * * lpf * lpf * test point 2200 f osc off out2 ( ? ) out2 ( + ) c5 c3 r1 c1 c2 r2 l1 c6 l2 c4 c8 c7 c14 c9 c13 c10 c11 c12 c24 c25 c26 c27 c28 c29 out1 ( ? ) out1 ( + ) c19 c23 l3 c22 c20 c17 r3 r4 c18 c21 l4 c15 c16 r5
TB2924AFG 2007-01-26 9 example application circuit * : output l (4 ? ): 10 h (a7502by-100m, a7503ay-100m, #953as-100m: toko, inc.) * : output c (4 ? ): 1.0 f * : output l (8 ? ): 18 h (a7502by-180m, a7503ay-180m, #953as-180m: toko, inc.) * : output c (8 ? ): 0.47 f * : the application circuits shown in this document are prov ided for reference purposes only. especially, thorough evaluation is required on the phase of mass production design. toshiba dose not grant the use of any industrial proper ty rights with these examples of application circuits. * : when no signal is present, the power supply current varies with the characteristics of the output inductance (out l). * : for all capacitors that are not indicated by the elec trolytic capacitor symbol, use ceramic capacitors with an appropriate withstand voltage. out c 100 k 1 2 3 4 5 6 7 8 9 10 11 12 28 29 30 19 20 21 22 23 24 25 26 27 out1 ( ? ) 13 14 15 16 17 18 31 32 33 34 35 36 heat sink heat sink v reg boot 1 ( + ) out 1 ( + ) nc pw gnd1 pw v cc1 nc boot 1 ( ? ) feed 1 ( + ) pre gnd1 rip/f nc in1 feed 1 ( ? ) v cc /2 stby mute nc nc boot 2 ( + ) out 2 ( + ) pw gnd2 out 2 ( ? ) pw v cc2 nc boot 2 ( ? ) osc out pre gnd2 osc sw in2 feed 2 ( ? ) feed 2 ( + ) nc osc in pre v cc 0.47 f in1 1 f 0.1 f out l out l out c out c r l 8 ? 1 f 1800 pf 1800 pf 1 f 220 f 0.1 f 0.1 f out l out l out c r l 8 ? 1 f gnd 1800 pf 1800 pf 470 pf 1 f in2 1 f 1000 f v cc 0.1 f standby on mute on 4.7 f osc off out2 ( + ) out2 ( ? ) out1 ( + ) out1 ( ? )
TB2924AFG 2007-01-26 10 toshiba?s pc board layout (mounting side) (back side)
TB2924AFG 2007-01-26 11 datas for reference (typ.) p out (w) ? p out (%) 0 0 20 40 60 80 100 6 2 4 10 8 12 14 16 v cc = 15 v f = 1 khz r l = 8 ? 5 0 0 v cc = 15 v f = 1 khz r l = 8 ? 2 4 6 8 10 12 1 2 3 4 25 0 0 f = 1 khz r l = 8 ? thd = 10% analyzer filter: 400 hz to 30 khz output: 30 k lpf 5 10 15 20 5 10 15 20 out2 out1 50 0.01 0.01 f = 1 khz r l = 8 ? 1 k: 400 to 30 k + 30 khz lpf 0.1 1 10 100 0.1 1 10 0.03 0.05 0.3 0.5 3 5 30 0.03 0.3 3 30 out1_12 v out2_12 v out1_15 v out2_15 v 50 0.01 0.01 v cc = 15 v r l = 8 ? 100: to 30 k 1 k: 400 to 30 k 10k: 400 to + 30 khz lpf 0.1 1 10 100 0.1 1 10 0.03 0.05 0.3 0.5 3 5 30 0.03 0.3 3 30 out2_1 k out2_100 out1_100 out1_1 k out2_10 k out1_10 k p out (w) thd ? p out _f thd (%) p out (w) thd ? p out _v cc thd (%) f (hz) thd ? f thd (%) v cc (v) p out _v cc p out (w) p out (w) p d ? p out p d (w) 50 0.01 10 v cc = 15 v r l = 8 ? p out = 1 w filtr: to 30 k (f = 20~800) 400 to 30 k (f = 1 k to 2 k) 400 to 80 k (f = 4 k to 6 k) 400 to (f = 8 k to 40 k) + 30 khz lpf 100 1000 10000 100000 0.1 1 10 0.03 0.05 0.3 0.5 3 5 30 out2 out1
TB2924AFG 2007-01-26 12 0 ? 80 10 out1 out2 v cc = 15 v r l = 8 ? r g = 10 k ? v out = 0.775 vrms out2 out1 100 1000 10000 100000 ? 60 ? 40 ? 20 60 0 0 v cc = 15 v r l = 8 ? v in = 0 v 0.5 1.0 1.5 2.0 2.5 3.0 3.5 10 20 30 40 50 140 0 0 r l = 8 ? v in = 0 v l = 18 h 20 40 60 80 100 120 5 10 15 20 25 30 f (hz) g v ? f g v (db) v cc (v) i ccq ? v cc i ccq (ma) v stb (v) i stby ? v stb i stb (ma) f (hz) c.t. ? f c.t. (db) 40 0 10 v cc = 15 v r l = 8 ? v out = 0.775 vrms output: 30 k lpf 30 20 10 100 1000 10000 100000 out2 out1 5 15 25 35 20 ? 100 0 f = 1 k r l = 8 ? v out = 1 vrms v cc = 15 v ? 80 ? 60 ? 40 ? 20 0 0.5 1.0 1.5 2.0 v mute (v) att mute ? v mute att mute (db) r g ( ? ) c.t. ? r g c.t. (db) 0 ? 80 10 out2 out1 f = 1 k r l = 8 ? v rip = 0.775 vrms v cc = 15 v out1 out2 100 1000 10000 ? 60 ? 40 ? 20 ? 70 ? 50 ? 30 ? 10
TB2924AFG 2007-01-26 13 0 ? 60 10 out1 r g = 620 ? r l = 8 ? v rip = 0.775 vrms v cc = 15 v 100 1000 10000 ? 50 ? 40 ? 30 ? 20 ? 10 out2 v cc (v) v no ? v cc v no (mvrms) f ripp (hz) r.r. ? f ripp ripple rejection r.r. (db) ambient temperature ta (c) p d ? ta allowable power dissipation p d (w) 0.5 0 0 out1 r l = 8 ? r g = 10 k ? v in = 0 v filt: din_audio 5 10 15 20 0.1 0.2 0.3 0.4 out2 r g ( ? ) v no ? r g v no (mvrms) r g ( ? ) r.r. ? r g ripple rejection r.r. (db) 0 ? 60 10 out2 r g = 620 ? r l = 8 ? v rip = 0.775 vrms v cc = 15 v 100 1000 10000 100000 ? 50 ? 40 ? 30 ? 20 ? 10 out1 1 0 10 out1 r l = 8 ? v cc = 15 v v in = 0 v filt: din_audio 100 1000 10000 0.2 0.4 0.6 0.8 out2 0 0 25 50 75 100 125 150 2 4 6 8 10 12 14 16 (1) infinite heat sink (2) no heat sink (when mounted on toshiba?s pc board)
TB2924AFG 2007-01-26 14 package dimensions weight: 0.85 g (typ.)
TB2924AFG 2007-01-26 15 strong electrical and magnetic fields devices exposed to strong magnetic fields can undergo a polarization phenomenon in their plastic material, or within the chip, which gives rise to abnormal symptoms such as impedance changes or increased leakage current. failures have been reported in lsis m ounted near malfunctioning deflection yokes in tv sets. in such cases the device?s installation location must be changed or the device must be shielded against the elec trical or magnetic field. shielding against magnetism is especially necessary for devices used in an alternating magnetic field because of the electromotive forces generated in this type of environment. ? use an appropriate power supply fuse to ensure that a lar ge current does not continuously flow in case of over current and/or ic failure. the ic will fully break down when used under conditions that exceed its absolute maximum ratings, when the wiring is routed improperly or when an abnormal pulse noise occurs from the wiring or load, causing a large current to continuously flow and t he breakdown can lead smoke or ignition. to minimize the effects of the flow of a large current in case of breakdown, appropriate settings , such as fuse capacity, fusing time and insertion circuit location, are required. ? if your design includes an inductive load such as a moto r coil, incorporate a protection circuit into the design to prevent device malfunction or breakdown caused by the current resulting from the inrush current at power on or the negative current resulting from the back electromotive force at powe r off. for details on how to connect a protection circuit such as a current lim iting resistor or back electromotive forc e adsorption diode, refer to individual ic datasheets or the ic databook. ic breakdown may cause injury, smoke or ignition. ? use a stable power supply with ics with built-in protection functions. if the power supply is unstable, the protection function may not operate, causing ic breakdown. ic breakdown may cause injury, smoke or ignition. ? carefully select external components (such as inputs and negative feedback capacitors) and load components (such as speakers), for example, powe r amp and regulator. if there is a lar ge amount of leakage current such as input or negative feedback condenser, t he ic output dc voltage will increase. if this output voltage is connected to a speaker with low input withstand voltage, overcurrent or ic failure can cause smoke or ignition. (the over current can cause smoke or ignition from the ic itself.) in particular, please pay attention when using a bridge tied load (btl) connection type ic that inputs output dc voltage to a speaker directly. ? over current protection circuit over current protection circuits (referred to as current li miter circuits) do not necessarily protect ics under all circumstances. if the over current protec tion circuits operate against the over cu rrent, clear the over current status immediately. depending on the method of use and us age conditions, such as exceeding absolute maximum ratings can cause the over current protection circuit to not operate properly or ic break down before operation. in addition, depending on the method of use and usage conditions, if over current continues to flow for a long time after operation, the ic may generat e heat resulting in breakdown. ? thermal shutdown circuit thermal shutdown circuits do not necessarily protect ic s under all circumstances. if the thermal shutdown circuits operate against the over temperature, clear the heat generation status immediately. depending on the method of use and usage conditions, such as exceeding absolute ma ximum ratings can cause the thermal shutdown circuit to not operate properly or ic breakdown before operation. ? heat radiation design when using an ic with large current flow such as power amp, regulator or driver, please design the device so that heat is appropriately radiated, not to exceed the specified junction temperat ure (tj) at any time and condition. these ics generate heat even during norma l use. an inadequate ic heat radiat ion design can lead to decrease in ic life, deterioration of ic characte ristics or ic breakdown. in addition, please design the device taking into considerate the effect of ic heat r adiation with peripheral components. ? installation to heat sink please install the power ic to the heat sink not to apply excessive mechanical stress to the ic. excessive mechanical stress can lead to package cra cks, resulting in a reduction in reli ability or breakdown of internal ic chip. in addition, depending on the ic, the use of silic on rubber may be prohibited. check whether the use of silicon rubber is prohibited for the ic you intend to use, or not. for details of power ic heat radiation design and heat sink installation, refer to individual technical datasheets or ic databooks.
TB2924AFG 2007-01-26 16 restrictions on product use 060925ebf ? the information contained herein is subject to change without notice. 021023_d ? toshiba is continually working to improve the quality and reliability of its products. nevertheless, semiconductor devices in general can malfunction or fail due to their i nherent electrical sensitivity and vulnerability to physical stress. it is the responsibility of the buyer, when utilizing toshiba products, to comply with the standards of safety in making a safe design for the entire system, and to avoid situations in which a malfunction or failure of such toshiba products could cause loss of human life, bodily injury or damage to property. in developing your designs, please ensure that toshiba products are used within s pecified operating ranges as set forth in the most recent toshiba products specific ations. also, please keep in mind the precautions and conditions set forth in the ?handling guide for semiconduct or devices,? or ?toshiba semiconductor reliability handbook? etc. 021023_a ? the toshiba products listed in this document are in tended for usage in general electronics applications (computer, personal equipment, office equipment, measuri ng equipment, industrial robotics, domestic appliances, etc.). these toshiba products are neither intended nor warranted for usage in equipment that requires extraordinarily high quality and/or reliability or a malfuncti on or failure of which may cause loss of human life or bodily injury (?unintended usage?). unintended usage incl ude atomic energy control in struments, airplane or spaceship instruments, transportation instruments, traf fic signal instruments, comb ustion control instruments, medical instruments, all types of safety devices, et c. unintended usage of toshiba products listed in this document shall be made at the customer?s own risk. 021023_b ? the products described in this document shall not be used or embedded to any downstream products of which manufacture, use and/or sale are prohibited under any applicable laws and regulations. 060106_q ? the information contained herein is presented only as a guide for the applications of our products. no responsibility is assumed by toshiba for any infringement s of patents or other rights of the third parties which may result from its use. no license is granted by implicat ion or otherwise under any pa tent or patent rights of toshiba or others. 021023_c ? the products described in this document are subject to foreign exchange and foreign trade control laws. 060925_e ? this product generates heat during nor mal operation. however, substandar d performance or malfunction may cause the product and its peripherals to reach abnormally high temperatures. the product is often the final stage (the external out put stage) of a circuit. substandard performance or malfunction of the destination device to which the circuit supplies output may cause damage to the circuit or to the product. 030619_r about solderability, following conditions were confirmed ? solderability (1) use of sn-37pb solder bath solder bath temperature = 230c dipping time = 5 seconds the number of times = once use of r-type flux (2) use of sn-3.0ag-0 .5cu solder bath solder bath temperature = 245c dipping time = 5 seconds the number of times = once use of r-type flux

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